1. DIE is die

DIE.CPB1

DIE.CPB2

...

DIE.CPB7

Stacked die in die BGA package;

chip bond pads

2.

DIE.CBPAssignment1

Assignment1

Count

Height

Length

Width

DIE.FormatId

DIE.SBP1

DIE.SBPGuideCount

DIE.WB1

DIE.WBCount

DIE.WBRules.MaxAngle

DIE.WBRules.MaxLength

DIE.WBRules.MinLength

DIE.WBRules.WBtoPad

DIE.WBRules.WToWDistance

3.

Geometry.Height

Manufacturer #1

Part_Field_Name_1

4.

Rules.Clearance.Board.Pad 

(Board,Copper,Drill,SMD,Text) to(Pads,SMD,Trace,Via)

Pad to (pad,trace,via)

Trace to Trace

via to (Trace,via)

Rules.Width.Maximum,Rules.Width.Minimum,Rules.Width.Recommended

Rules.ViaAtSMD.FitInside

Rules.SameNet.Pad.Crn,Rules.SameNet.SMD.Via

Rules.PadEntry.AnyAngle,Rules.PadEntry.Side,Rules.PadEntry.Corner,Rules.PadEntry.Soft;

Rules.Fanout.Alignment;

Rules.Fanout.Alignment.Multi-Row;

Rules.Fanout.Direction;

Rules.Fanout.Length.Maximum;

Rules.Fanout.Length.Unlimited;

Rules.Fanout.Nets.Plane;

Rules.Fanout.Nets.Signal;

Rules.Fanout.Nets.UnusedPins;

Rules.Fanout.Sharing.Pin;

Rules.Fanout.Sharing.SMD;

Rules.Fanout.Sharing.Trace;

Rules.Fanout.Sharing.Via;

Rules.Fanout.ViaSpacing;

5.

Body Style　　元件类型

Voltage Rating 额定电压

T.C.R or TCR(Temperature Coefficient of Resistance   [电] 电阻温度系数)

Rating 额定值

Polar  极性，极坐标

Reference 参考，引用

Tolerance  公差，耐受性

Current Rating 额定电流

Created  by/date  Sean6/2014-0528

Checked by/date  Sean6/2014-0528